SAM Target Costing Expert

工作职责

Electronics & Semiconductor Should Cost

  • Rapid should-cost assessment for semiconductors, MCU/ASIC, sensors, power electronics, PCB/PCBA, connectors and passive components.
  • Build cost logic based on wafer process, die size, yield, packaging, testing, PCB technology and SMT assembly.
  • Develop reusable calculation models and challenge supplier quotations with fact-based cost drivers.

Quotation & Sourcing Support

  • Set competitive electronic BOM targets, including piece price, NRE/tooling and productivity assumptions.
  • Support supplier negotiation, localization, second source and technology scenario evaluation.
  • Track target achievement and drive cost-gap closure with R&D, Purchasing and Product Management.

 

Design to Value

  • Participate early in concept and design phases and translate customer needs and market trends into target functions and allowable cost.
  • Identify over-specification, unnecessary complexity and low-value features.
  • Drive DtV, DtC and Re-DtC activities and evaluate architecture and performance-cost trade-offs.

 

Benchmark & Competence Building

  • Lead electronics tear-down and competitor cost benchmarking.
  • Build China/Asia electronics market intelligence, supplier knowledge and cost databases.
  • Transfer China insights and best practices to Asia and selected global projects.

    Electronics & Semiconductor Should Cost

  • Rapid should-cost assessment for semiconductors, MCU/ASIC, sensors, power electronics, PCB/PCBA, connectors and passive components.
  • Build cost logic based on wafer process, die size, yield, packaging, testing, PCB technology and SMT assembly.
  • Develop reusable calculation models and challenge supplier quotations with fact-based cost drivers.
  • Quotation & Sourcing Support

  • Set competitive electronic BOM targets, including piece price, NRE/tooling and productivity assumptions.
  • Support supplier negotiation, localization, second source and technology scenario evaluation.
  • Track target achievement and drive cost-gap closure with R&D, Purchasing and Product Management.
  •  

    Design to Value

  • Participate early in concept and design phases and translate customer needs and market trends into target functions and allowable cost.
  • Identify over-specification, unnecessary complexity and low-value features.
  • Drive DtV, DtC and Re-DtC activities and evaluate architecture and performance-cost trade-offs.
  •  

    Benchmark & Competence Building

  • Lead electronics tear-down and competitor cost benchmarking.
  • Build China/Asia electronics market intelligence, supplier knowledge and cost databases.
  • Transfer China insights and best practices to Asia and selected global projects.
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职位要求

  • Bachelor’s or Master’s degree in Electronics, Microelectronics, Semiconductor Engineering or a related field.
  • Minimum 5 years of experience in automotive electronics, semiconductor manufacturing, electronic component engineering, cost engineering, technical purchasing or value engineering.
  • Strong knowledge of semiconductor manufacturing flow, packaging/testing, PCB/PCBA processes, electronics supply chain and should-cost methodology.
  • Able to convert incomplete technical information into a fast, structured and defendable cost estimate with transparent assumptions.
  • Strong commercial sense, analytical thinking and cross-functional communication skills; proficient in English.
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我们可以提供

FAST SHOULD COST
Quickly evaluates chipset and electronic component cost.

MARKET-BACK
Understands what customers and markets truly need.

FACT-BASED CHALLENGER
Challenges suppliers and specifications with cost transparency.

VALUE CREATOR
Moves beyond calculation to actively drive Design to Value.

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